JPH05234875

PURPOSE:To form a flat film on an uneven surface by providing the film on the uneven surface by using coating solution containing a film forming material in highly fluidized hydrophilic medium. CONSTITUTION:A vacuum chamber 1 has an inlet 2 for highly fluidized hydrophilic medium such as coating sol...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAMURA GOHEI, HORIIKE YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To form a flat film on an uneven surface by providing the film on the uneven surface by using coating solution containing a film forming material in highly fluidized hydrophilic medium. CONSTITUTION:A vacuum chamber 1 has an inlet 2 for highly fluidized hydrophilic medium such as coating solution containing a film forming material, for example, resist in superpure water, a drain port 3 to be used also as an exhaust port, and a substrate holder 4. A mixture ratio of the medium to the material of the solution is selected in response to a type of a film to be formed. A semiconductor wafer 5 is fixed to the holder 4, for example, by an electrostatic chuck, etc., and the holder 4 can be cooled or heated and rotated. Thus, a flat film can be formed on the entire uneven surface.