ELECTROPLATING METHOD

PURPOSE:To provide an electroplating method by which a uniform plating film is formed in the area to be plated without requiring a conducting part for electrically connecting the areas to be plated even though independent areas to be plated exist. CONSTITUTION:An electroplating method is provided so...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIZAWA IZURU, YAMAGUCHI NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide an electroplating method by which a uniform plating film is formed in the area to be plated without requiring a conducting part for electrically connecting the areas to be plated even though independent areas to be plated exist. CONSTITUTION:An electroplating method is provided so that an energizing electrode may be put on the surface to be treated of a body to be treated 1 where there are independent areas to be plated in the surface to be treated in a plating bath and simultaneously electroplating may be performed while a contact position of the energizing electrode to the surface to be treated is changed.