EPOXY RESIN MOLDING MATERIAL FOR SEALING

PURPOSE:To provide the subject molding composition comprising a specific spherical inorganic filler and a specified inorganic filler, maintaining the high thermal conductivity, excellent in the low mold-abrading property and moldability, and useful for electric.electronic parts, etc. CONSTITUTION:Th...

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Bibliographische Detailangaben
Hauptverfasser:	KYOTANI YASUHIRO, KAGAWA HIROHIKO, MIYATANI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the subject molding composition comprising a specific spherical inorganic filler and a specified inorganic filler, maintaining the high thermal conductivity, excellent in the low mold-abrading property and moldability, and useful for electric.electronic parts, etc. CONSTITUTION:The objective molding material comprises an epoxy resin such as a bisphenol A type epoxy resin, (A) a spherical inorganic feller such as spherical silica having an average particle diameter of