PLASMA TREATMENT DEVICE

PURPOSE:To prevent breakage of a susceptor and burning/short circuit, etc., of an electrostatic chuck sheet and further to improve yield by preventing generation of particle. CONSTITUTION:A susceptor 14 is a disc body which is formed of a thick wafer mount base 14a and a thin brim part or a flange part 14b integrally. A peripheral part 14c of an upper side of the wafer mount base 14a, that is, a wafer mount surface is formed to a curved surface of a large curvature radius. The wafer mount surface of the susceptor 14 is crowned with an electrostatic chuck sheet 20 and a semiconductor wafer 22 is mounted on the electrostatic chuck sheet 20. The electrostatic chuck sheet 20 is formed to a solid configuration whose peripheral part 20d covers the curved peripheral part 14c of the susceptor 14 and alamid resin before crystallization is used as a material of high polymer film of the sheet. The alamid resin is a swelling gel film before it is dried and thermally treated and crystallization treatment of polymer is not performed; therefore, deep drawing is possible.