SEMICONDUCTOR DEVICE
PURPOSE:To provide a semiconductor device that incorporates a chip capacitor on a semiconductor chip. CONSTITUTION:Two conductive plates 3 and 4 are provided in array on a semiconductor chip 1, and a chip capacitor 5 is fixed onto them by bonding with conductive adhesive agent. Electrodes are electr...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PURPOSE:To provide a semiconductor device that incorporates a chip capacitor on a semiconductor chip. CONSTITUTION:Two conductive plates 3 and 4 are provided in array on a semiconductor chip 1, and a chip capacitor 5 is fixed onto them by bonding with conductive adhesive agent. Electrodes are electrically connected, and the semiconductor chip 1 and the other component parts are covered with a resin sealed type package 8, whereby a semiconductor package excellent in mounting density on a board can be formed. |
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