MANUFACTURE OF PRINTED WIRING BOARD

PURPOSE:To prevent the deposition of defective film and form a uniform film in electrodeposition of resist on a printed wiring board by a constant current method by changing the current density when in the state of a minute and/or thin film. CONSTITUTION:In electrodeposition of resist on a printed w...

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Bibliographische Detailangaben
Hauptverfasser:	USAGAWA MICHINOBU, KUBOI YOSHIYUKI, FUJIMORI SHOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the deposition of defective film and form a uniform film in electrodeposition of resist on a printed wiring board by a constant current method by changing the current density when in the state of a minute and/or thin film. CONSTITUTION:In electrodeposition of resist on a printed wiring board by a constant current method, the current density is changed when in the state of a minute and/or thin film. The printed wiring board may use such resins as epoxy, phenol, unsaturated polyester and silicone. For example, the surface of a glass cloth based epoxy resin laminate is subjected to a resist electrodeposition on a current of 55mA/dm for 30sec for the first and second stages and for 115sec for the third. Since a minute and/or thin film is to be formed in the second stage, the current density is reduced therein. This eliminates the deposition of defective electrodeposition films, obtaining uniform films.