WAFER ABNORMALITY SENSOR AND INSPECTING METHOD FOR WAFER

WAFER ABNORMALITY SENSOR AND INSPECTING METHOD FOR WAFER

PURPOSE:To prevent the increase in an accident by sensing a crack of a wafer based on the state of an orientation flat end face. CONSTITUTION:A pair of reflection type optical sensors 9, 10 are so provided as to be opposed, for example, substantially perpendicularly to aligned orientation flat end f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WAKIYAMA FUMITOSHI, SAKAMOTO SHOZO, NISHIZUKA HIROSHI, TAKAHASHI NOBUYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To prevent the increase in an accident by sensing a crack of a wafer based on the state of an orientation flat end face. CONSTITUTION:A pair of reflection type optical sensors 9, 10 are so provided as to be opposed, for example, substantially perpendicularly to aligned orientation flat end faces 8 and that focal lengths are disposed on the faces 8. The sensors 9, 10 are scanned in a wafer 1 arranging direction (F direction) to detect presence or absence and abnormality of the wafer 1 by receiving reflected lights of the faces 8. Thus, an increase in an accident can be prevented.