OUTER LEAD BONDING METHOD

PURPOSE:To enable the deviation of a panel terminal and a board terminal from each other due to their thermal expansion to be limited to such an extent that it substantially causes no trouble by a method wherein a flexible board is expanded absorbing moisture in an atmosphere of prescribed relative...

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Bibliographische Detailangaben
1. Verfasser:	NAGASAWA HIROSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To enable the deviation of a panel terminal and a board terminal from each other due to their thermal expansion to be limited to such an extent that it substantially causes no trouble by a method wherein a flexible board is expanded absorbing moisture in an atmosphere of prescribed relative humidity. CONSTITUTION:Before outer leads are bonded, a flexible board 1 is made to previously absorb humidity in an atmosphere of certain relative humidity shown by formulas I, II, and III (Hr: relative humidity, alphaT: humidity expansion coefficient, TB: outer lead bonding temperature). A flexible board 1 is connected to a signal input terminal 6 of a liquid crystal panel 2 by an output terminal 5 through an anisotropic conductive film 7 by thermocompression. By this setup, the deviation of an output terminal from a panel terminal can be lessened.