COMPOSITE ELECTRONIC PARTS

PURPOSE:To obtain a composite electronic part which can be sucked by a suction chuck and also subjected to automatic mounting by covering the top of a module substrate, on the upper surface of which electronic components are mounted, with a metal cap with its upper surface formed flat by folding a metal plate. CONSTITUTION:The top of a module substrate 1, on the upper surface of which electronic components are mounted, is covered with a metal cap 11 with its upper surface 12 flatly formed by folding a metal plate. For example, the metal cap 11 is formed so as to be fitted to opposite ends of the substrate 1 across lateral electrodes 7 with the upper surface 12 made flat by punching a metal plate, such as stainless or brass, and folding it. Areas where the end face of the cap and the substrate and/or where the cap comes into contact with mounted components are subjected to an adhesive such as epoxy, whereby the cap is adhered to the substrate 1.