OUTER LEAD BONDING METHOD

PURPOSE:To enable the limitation of the deviation by the thermal expansion of a panel terminal and a substrate terminal to a substantially negligible level by placing a specific retaining film on a flexible substrate and pressing the film from above to connect the two terminals. CONSTITUTION:A liqui...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAGASAWA HIROSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To enable the limitation of the deviation by the thermal expansion of a panel terminal and a substrate terminal to a substantially negligible level by placing a specific retaining film on a flexible substrate and pressing the film from above to connect the two terminals. CONSTITUTION:A liquid crystal driver IC 3 is connected to an inner lead 4 and is mounted to the flexible substrate 1. The output terminal 5 of this flexible substrate 1 is connected to the signal input terminal 6 of a liquid crystal panel 2 with an anisotropic conductive film 7. The retaining film 9 having >=250 deg.C m.p., 800kg/mm modulus of elasticity in at least one direction and