OUTSIDE SEMICONDUCTOR LAYER CUTTER
PURPOSE:To provide an outside semiconductor layer cutter for a CV cable which can finish the surface too after cutting with high accuracy without the fear of damage of an insulating layer. CONSTITUTION:This cutter is equipped with a bite 13, which cuts the outside semiconductor layer 12 of a CV cabl...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To provide an outside semiconductor layer cutter for a CV cable which can finish the surface too after cutting with high accuracy without the fear of damage of an insulating layer. CONSTITUTION:This cutter is equipped with a bite 13, which cuts the outside semiconductor layer 12 of a CV cable 11, a bite rotating mechanism 14, which includes a rotary plate 17 for rotating this bite 13 along the periphery of the outside semiconductor layer 12, a traverse mechanism 15, which includes a power transmitting shaft 20 for shifting the bite 13 in the axial direction of the CV cable 11, a small spur gear 21, etc., and a finishing mechanism, which automatically follows the irregularity after the cutting by the bite 13 and finishes it smoothly. |
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