OUTSIDE SEMICONDUCTOR LAYER CUTTER

PURPOSE:To provide an outside semiconductor layer cutter for a CV cable which can finish the surface too after cutting with high accuracy without the fear of damage of an insulating layer. CONSTITUTION:This cutter is equipped with a bite 13, which cuts the outside semiconductor layer 12 of a CV cabl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HASEGAWA HIROYUKI, HOTTA NOBUHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To provide an outside semiconductor layer cutter for a CV cable which can finish the surface too after cutting with high accuracy without the fear of damage of an insulating layer. CONSTITUTION:This cutter is equipped with a bite 13, which cuts the outside semiconductor layer 12 of a CV cable 11, a bite rotating mechanism 14, which includes a rotary plate 17 for rotating this bite 13 along the periphery of the outside semiconductor layer 12, a traverse mechanism 15, which includes a power transmitting shaft 20 for shifting the bite 13 in the axial direction of the CV cable 11, a small spur gear 21, etc., and a finishing mechanism, which automatically follows the irregularity after the cutting by the bite 13 and finishes it smoothly.