OUTER LEAD BONDING METHOD

PURPOSE:To provide the outer lead bonding method which limits the deviation between an input signal terminal formed on a liquid crystal panel and the output terminal of a flexible substrate, where a liquid crystal driver IC is connected due to thermal expansion to the extent where no substantial pro...

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Bibliographische Detailangaben
1. Verfasser:	NAGASAWA HIROSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the outer lead bonding method which limits the deviation between an input signal terminal formed on a liquid crystal panel and the output terminal of a flexible substrate, where a liquid crystal driver IC is connected due to thermal expansion to the extent where no substantial problem is generated. CONSTITUTION:For this outer lead bonding method, a sheet 9 of paraamide fiber which has a >=300g/d modulus of elasticity and a