JOINT METHOD OF ELECTRONIC PART CARRIER COVER TAPE

PURPOSE:To offer a joint method of electronic part carrier cover tapes to be fusion-bonded on a carrier substrate, by which even when the electronic part carrier cover tapes are jointed by a hot-melt type adhesive layer provided on a side, the joint part can be as well fusion-bonded on the carrier s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AIZAWA KAORU, MAMIYA MASATOSHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To offer a joint method of electronic part carrier cover tapes to be fusion-bonded on a carrier substrate, by which even when the electronic part carrier cover tapes are jointed by a hot-melt type adhesive layer provided on a side, the joint part can be as well fusion-bonded on the carrier substrate as the cover tape can. CONSTITUTION:In a joint method of electronic part carrier cover tapes 1 whose adhesive surfaces are coated with hot-melt type adhesives, an adhesive surface 12 of one of tape ends 10 is laid on a non-adhesive surface 11 of the other tape end 10, and a heating plate 3 or a tool horn is brought in contact with the non-adhesive surface 11 of the overlapping part to fusion-bound the overlapping part by means of heat sealing method or supersonic welder method.