SEMICONDUCTOR DEVICE

PURPOSE:To obtain a semiconductor package having leads for testing, which can be coped with a test in which a plurality of data input/output are required and also can be simplified after completion. CONSTITUTION:The leads 3, to be exclusively used for testing, are collectively led out, and they are...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IDE HIROSHI, URAGAMI KEN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain a semiconductor package having leads for testing, which can be coped with a test in which a plurality of data input/output are required and also can be simplified after completion. CONSTITUTION:The leads 3, to be exclusively used for testing, are collectively led out, and they are cut off on the outside. The led out testing leads 3 are fixed by a package member 5, and they are covered with the package member 4 of the main body. As a result, the time for testing can be cut down, and at the same time, the package can be made small in size.