SEMICONDUCTOR ACCELERATION SENSOR AND ITS ASSEMBLING METHOD

PURPOSE:To easily position parts with high positional accuracy by fixing a metallic piece for positioning to a base after mounting such parts as a pedestal, semiconductor element, weight, etc., on the metallic piece. CONSTITUTION:Since the positioning projections 8a, 8b, and 8c for a pedestal 2, sem...

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Bibliographische Detailangaben
Hauptverfasser: YAGOURA HIDEYA, KOBAYASHI EIJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To easily position parts with high positional accuracy by fixing a metallic piece for positioning to a base after mounting such parts as a pedestal, semiconductor element, weight, etc., on the metallic piece. CONSTITUTION:Since the positioning projections 8a, 8b, and 8c for a pedestal 2, semiconductor element 4, and weight 5 are respectively formed on a metallic piece 8 for mounting parts, the parts can be easily positioned and, at the same time, the positional accuracy of the parts is also improved. In addition, since a positioning projection 8f for a base 1 is also formed and the metallic piece 8 is fixed to the based 1 with a bonding agent 3d by utilizing the section 8f, the workability and the positional accuracy between the base 1 and each mounted parts can be improved. In addition, when the clearances between projection 8d and a nail 8e for suppressing the downward and upward deformation of the element 4 and the weight 5 are appropriately selected, the damage of the element 4 can be prevented, since the clearances act as stoppers for stopping the deformation of the element 4 even when an impact or acceleration is applied to a semiconductor device.