METHOD FOR MEASURING CONCENTRATION OF COPPER ION IN CHEMICAL COPPER PLATING LIQUID

PURPOSE:To measure the concentration of copper ion accurately by measuring the absorbance and the alkali concentration of chemical copper plating liquid, and obtaining the concentration of the copper ions in the chemical copper plating liquid by the expression of relation for the copper-ion concentr...

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Bibliographische Detailangaben
Hauptverfasser:	NAKASO AKISHI, HASEGAWA KIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING
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Beschreibung
Zusammenfassung:	PURPOSE:To measure the concentration of copper ion accurately by measuring the absorbance and the alkali concentration of chemical copper plating liquid, and obtaining the concentration of the copper ions in the chemical copper plating liquid by the expression of relation for the copper-ion concentration obtained beforehand, the absorbance and the alkali concentration. CONSTITUTION:The main components of chemical copper plating liquid as an object are copper ions, chelate agent, reducing agent of copper ion and hydroxide of alkali metal. In the above described composition of the chemical plating liquid, the absorbance of the chemical plating liquid is changed with the concentration of the hydroxide of the alkali metal when the concentration of the copper ion is constant. Then, the expression of relation for the absorbance of the chemical plating liquid, the alkali concentration and the copper-ion concentration is obtained beforehand. The absorbance of the chemical copper plating liquid and the alkali concentration are measured by using the expression of relation. Thus, the concentration of the copper ions is measured. In the absorbance measurement at this time, the absorbance measurement within the wavelength range of 400-800nm is used.