SEMICONDUCTOR DEVICE

PURPOSE:To raise the mounting density of modules without being influenced by the miniaturization of a mother board by heaping up a plurality of modules apart in stories between a pair of boards erected on a mother board. CONSTITUTION:An electronic part 2 is mounted on a mounting board 8 which has an insertion type outer lead 8a. A pair of boards 10 are erected in opposition by inserting the outer leads into the through-holes 5a on a mother board 5. Each module 9 is heaped up specified intervals apart between the boards 10, and are put up by inserting each outer lead into the through holes 10b of both boards 10, which are spanned with a board 11 for wiring. The semiconductor device being made this way are mounted being heaped up above the mother board, with both ends of each module 9 supported with the boards 10, so it becomes possible to mount modules the number of heaps times the occupied area on the mother board 5, so the mounting density improves.