EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD

PURPOSE:To reduce defects in insulation in a printed circuit board caused by electrolytic corrosion or CAF(conductive anodic filaments). CONSTITUTION:An epoxy resin is compounded with a curative and an inorg. ion exchanger to give the objective compsn. The exchanger traps impurity ions and a hydroly...

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Bibliographische Detailangaben
1. Verfasser:	TAKADA TOSHIHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To reduce defects in insulation in a printed circuit board caused by electrolytic corrosion or CAF(conductive anodic filaments). CONSTITUTION:An epoxy resin is compounded with a curative and an inorg. ion exchanger to give the objective compsn. The exchanger traps impurity ions and a hydrolyzable chlorine present in the resin, the reducing electrolytic corrosion or CAF.