EPOXY RESIN COMPOSITION

PURPOSE:To obtain an epoxy resin compsn. which gives a molded article having a low water absorption rate and a low stress by compounding an epoxy resin component contg. a specific polyglycidyl ether with a curative for an epoxy compd. CONSTITUTION:An epoxy resin component contg. at least 10wt.% poly...

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Bibliographische Detailangaben
Hauptverfasser:	TAKUWA NARITSUYO, ARITOMI MICHIO, NAKAMURA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an epoxy resin compsn. which gives a molded article having a low water absorption rate and a low stress by compounding an epoxy resin component contg. a specific polyglycidyl ether with a curative for an epoxy compd. CONSTITUTION:An epoxy resin component contg. at least 10wt.% polyglycidyl ether of a styrenated phenol novolac resin of formula I (wherein G is a group of formula II or III; R1 and R2 are each H, or a 10C or lower hydrocarbon group optionally substd. by halogen, provided that when R1 is the hydrocarbon group, then at least one H atom of R1 may be further substd. by OG; and (n) is 0, or 1-10) is compounded with a curative for an epoxy compd. When the compsn. is used for sealing, a phenol novolac resin is a pref. curative; in the use for a laminate for a printed circuit board, curing with dicyandiamide is pref.