METHOD FOR MOLDING ORGANIC LOW MOLECULAR COMPOUND

PURPOSE:To melt and stick an org. low molecular compd. which is solid at ordinary temp. with the small quality of heat energy and to enable continuous remolding after cutting by partially melting the compd. at a temp. close to the m.p. and carrying out extrusion molding. CONSTITUTION:When an org. lo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UNO HIROSHI, MIYAMA MASAHIKO, FURUYA HIRONOBU, HARADA TOYOO, FUJIO TAKESHI, TAKAHASHI HIDEKI, TSUGAMI YOSHIYO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To melt and stick an org. low molecular compd. which is solid at ordinary temp. with the small quality of heat energy and to enable continuous remolding after cutting by partially melting the compd. at a temp. close to the m.p. and carrying out extrusion molding. CONSTITUTION:When an org. low molecular compd. having >=30 deg.C m.p. is molded, it is partially melted at the m.p. + or -3 deg.C, molded with an extrusion molding machine and cut. The org. low molecular compd. is fatty acid such as lauric acid, fat or oil such as semifat hardened oil. It is important to control the temp. of the extrusion molding machine and it is especially important to control the temp. of the die. The temp. of the die is set at the m.p. of the compd. + or -3 deg.C, preferably + or -1 deg.C. The extruded body is cut with a blade rotating at a high speed preferably near the ejection hole. The solid org. compd. can be molded with a small quantity of heat energy.