MANUFACTURE OF MULTILAYERED LAMINATE BOARD

PURPOSE:To enable a multilayered wiring board to be enhanced in dimensional stability without carrying out an annealing process. CONSTITUTION:A base material is impregnated with thermosetting resin and dried out for the formation of a prepreg 3, and the prepreg 3 is primarily formed into an inner ma...

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Bibliographische Detailangaben
1. Verfasser:	TAKADA TOSHIHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To enable a multilayered wiring board to be enhanced in dimensional stability without carrying out an annealing process. CONSTITUTION:A base material is impregnated with thermosetting resin and dried out for the formation of a prepreg 3, and the prepreg 3 is primarily formed into an inner material 2 by thermocompression. The prepreg 3 is laid on the surface of the inner material 2, which is secondarily formed into a multilayered laminate board by thermocompression. At this point, the glass transition temperature of resin contained in the inner material is set higher than the temperature of thermocompression carried out at a secondary formation process by 15 deg.C.