THIN FILM MULTILAYER WIRING BOARD

PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately la...

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1. Verfasser:	KIMIJIMA SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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