THIN FILM MULTILAYER WIRING BOARD

PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately la...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KIMIJIMA SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately laminated to form a thin film multilayer wiring board, and the thin film wiring layers are selectively connected together by interconnection 7a, 7b, and 7c provided through the insulating layers 3a and 3b, where two ground layers/power supply layers 5a, 5a', 5b, and 5b' are so provided as to be insulated from each other on the same layer like comb-teeth that are engaged with each other.