THIN FILM MULTILAYER WIRING BOARD

THIN FILM MULTILAYER WIRING BOARD

PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately la...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KIMIJIMA SUSUMU
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIMIJIMA SUSUMU
description PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately laminated to form a thin film multilayer wiring board, and the thin film wiring layers are selectively connected together by interconnection 7a, 7b, and 7c provided through the insulating layers 3a and 3b, where two ground layers/power supply layers 5a, 5a', 5b, and 5b' are so provided as to be insulated from each other on the same layer like comb-teeth that are engaged with each other.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH05136567A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH05136567A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH05136567A3</originalsourceid><addsrcrecordid>eNrjZFAM8fD0U3Dz9PFV8A31CfH0cYx0DVII9wzy9HNXcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqaGxmamZuaOxsSoAQAb0yJn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THIN FILM MULTILAYER WIRING BOARD</title><source>esp@cenet</source><creator>KIMIJIMA SUSUMU</creator><creatorcontrib>KIMIJIMA SUSUMU</creatorcontrib><description>PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately laminated to form a thin film multilayer wiring board, and the thin film wiring layers are selectively connected together by interconnection 7a, 7b, and 7c provided through the insulating layers 3a and 3b, where two ground layers/power supply layers 5a, 5a', 5b, and 5b' are so provided as to be insulated from each other on the same layer like comb-teeth that are engaged with each other.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930601&amp;DB=EPODOC&amp;CC=JP&amp;NR=H05136567A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930601&amp;DB=EPODOC&amp;CC=JP&amp;NR=H05136567A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIMIJIMA SUSUMU</creatorcontrib><title>THIN FILM MULTILAYER WIRING BOARD</title><description>PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately laminated to form a thin film multilayer wiring board, and the thin film wiring layers are selectively connected together by interconnection 7a, 7b, and 7c provided through the insulating layers 3a and 3b, where two ground layers/power supply layers 5a, 5a', 5b, and 5b' are so provided as to be insulated from each other on the same layer like comb-teeth that are engaged with each other.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAM8fD0U3Dz9PFV8A31CfH0cYx0DVII9wzy9HNXcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqaGxmamZuaOxsSoAQAb0yJn</recordid><startdate>19930601</startdate><enddate>19930601</enddate><creator>KIMIJIMA SUSUMU</creator><scope>EVB</scope></search><sort><creationdate>19930601</creationdate><title>THIN FILM MULTILAYER WIRING BOARD</title><author>KIMIJIMA SUSUMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05136567A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIMIJIMA SUSUMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIMIJIMA SUSUMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THIN FILM MULTILAYER WIRING BOARD</title><date>1993-06-01</date><risdate>1993</risdate><abstract>PURPOSE:To provide a thin film multilayer wiring board which is suitable for constituting an MCM (multichip module) of high function. CONSTITUTION:Thin film wiring layers which contain ground layer/power supply layers 5a, 5a', 5b, and 5b' and insulating layers 3a, 3b,... are alternately laminated to form a thin film multilayer wiring board, and the thin film wiring layers are selectively connected together by interconnection 7a, 7b, and 7c provided through the insulating layers 3a and 3b, where two ground layers/power supply layers 5a, 5a', 5b, and 5b' are so provided as to be insulated from each other on the same layer like comb-teeth that are engaged with each other.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH05136567A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title THIN FILM MULTILAYER WIRING BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T18%3A42%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIMIJIMA%20SUSUMU&rft.date=1993-06-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH05136567A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true