METHOD OF BONDING SEMICONDUCTOR CHIP

PURPOSE: To provide a bonding method of a semiconductor chip that can prevent a short-circuiting phenomenon, generated due to the contact between a lead and the semiconductor chip. CONSTITUTION: A bonding pad 23 of a semiconductor chip 25 and a lead 29 are bonded by a bump 31, that is formed via a t...

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Bibliographische Detailangaben
Hauptverfasser:	CHIYOI WANNGIYUN, PAKU KI, KIMU JINNHO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: To provide a bonding method of a semiconductor chip that can prevent a short-circuiting phenomenon, generated due to the contact between a lead and the semiconductor chip. CONSTITUTION: A bonding pad 23 of a semiconductor chip 25 and a lead 29 are bonded by a bump 31, that is formed via a through-hole 27 formed at the lead 29.