INSPECTING APPARATUS FOR DEFECT OF WAFER

PURPOSE:To reliably inspect a defect on the surface of a wafer at high speeds by photographing the surface of the wafer by means of a plurality of line image sensor elements shifted one another while moving the wafer relatively to a plurality of line image sensors. CONSTITUTION:A plurality of CCD li...

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Bibliographische Detailangaben
Hauptverfasser:	IDEKAWA HIROSHI, AMAI TSUTOMU, TSUCHIYA NORIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PURPOSE:To reliably inspect a defect on the surface of a wafer at high speeds by photographing the surface of the wafer by means of a plurality of line image sensor elements shifted one another while moving the wafer relatively to a plurality of line image sensors. CONSTITUTION:A plurality of CCD line image sensors 1-A, 1-B, 1-C constituting an image detecting mechanism to photograph the surface of a wafer have a plurality of sensor elements A-1-A-3, B-1-B-3, C-1-C-3 corresponding to pixels. The line image sensors 1-A-1-C are shifted one another by a distance obtained by dividing the size of one pixel by the number of the line image sensors. While the wafer is moved relatively to the line image sensors 1-A-1-C by a moving means, the wafer is photographed and, the obtained image data is analyzed by an image analyzing means thereby to detect a defect.