DEVICE AND METHOD FOR OPTICAL FIBER-INTERFACE

PURPOSE: To obtain one or plural optical fiber links with a thermal conductive module(TCM) by storing a substrate loading a transmitter/receiver on its surface together with the end part of an optical fiber in a housing. CONSTITUTION: The connection of a transmitter/receiver to be interfaced with an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ROORENSU JIYAKOBOBUITSUTSU, MARIO ENRIKE ETSUKAA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE: To obtain one or plural optical fiber links with a thermal conductive module(TCM) by storing a substrate loading a transmitter/receiver on its surface together with the end part of an optical fiber in a housing. CONSTITUTION: The connection of a transmitter/receiver to be interfaced with an optical fiber 23 is loaded on a substrate 40 having a semiconductor chip 50, and an integrating means 20 for aligning and supporting the fiber 23 and passing the fiber 23 in a shielded environment is prepared. The substrate 40 fixing the transmitter/receiver on its surface together with the end part of the fiber 23 is stored in the housings 12, 14, 16. An optical fiber fitting assembly to be the integrating means 20 is arranged along the side face of a TCM 10 between a pair of adjacent bolts 18 and has a multi-core optical fiber cable 25 having one or plural optical fibers 23.