EXPOSING METHOD FOR PRINTED WIRING BOARD
PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a...
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| creator | ASANO TOMOAKI |
| description | PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a surface conductor layer 1 is prepared and the scattering mirror 7 is placed on the aligner table 4 while having its mirror surface opposite from the table 4; and the board 3 is placed thereupon and irradiated with ultraviolet rays while a photomask 5 is matched thereby photopolymerizing the resist layer 2 selectively. Light which passes through a through hole 6 at the time of the ultraviolet-ray irradiation is irregularly reflected by the scattering mirror and the internal wall of the hole 6 is exposed. |
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CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a surface conductor layer 1 is prepared and the scattering mirror 7 is placed on the aligner table 4 while having its mirror surface opposite from the table 4; and the board 3 is placed thereupon and irradiated with ultraviolet rays while a photomask 5 is matched thereby photopolymerizing the resist layer 2 selectively. Light which passes through a through hole 6 at the time of the ultraviolet-ray irradiation is irregularly reflected by the scattering mirror and the internal wall of the hole 6 is exposed.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920326&DB=EPODOC&CC=JP&NR=H0493950A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920326&DB=EPODOC&CC=JP&NR=H0493950A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ASANO TOMOAKI</creatorcontrib><title>EXPOSING METHOD FOR PRINTED WIRING BOARD</title><description>PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a surface conductor layer 1 is prepared and the scattering mirror 7 is placed on the aligner table 4 while having its mirror surface opposite from the table 4; and the board 3 is placed thereupon and irradiated with ultraviolet rays while a photomask 5 is matched thereby photopolymerizing the resist layer 2 selectively. Light which passes through a through hole 6 at the time of the ultraviolet-ray irradiation is irregularly reflected by the scattering mirror and the internal wall of the hole 6 is exposed.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBwjQjwD_b0c1fwdQ3x8HdRcPMPUggI8vQLcXVRCPcMAsk4-TsGufAwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknivAA8DE0tjS1MDR2MilAAAzK0j7g</recordid><startdate>19920326</startdate><enddate>19920326</enddate><creator>ASANO TOMOAKI</creator><scope>EVB</scope></search><sort><creationdate>19920326</creationdate><title>EXPOSING METHOD FOR PRINTED WIRING BOARD</title><author>ASANO TOMOAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0493950A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ASANO TOMOAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ASANO TOMOAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EXPOSING METHOD FOR PRINTED WIRING BOARD</title><date>1992-03-26</date><risdate>1992</risdate><abstract>PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a surface conductor layer 1 is prepared and the scattering mirror 7 is placed on the aligner table 4 while having its mirror surface opposite from the table 4; and the board 3 is placed thereupon and irradiated with ultraviolet rays while a photomask 5 is matched thereby photopolymerizing the resist layer 2 selectively. Light which passes through a through hole 6 at the time of the ultraviolet-ray irradiation is irregularly reflected by the scattering mirror and the internal wall of the hole 6 is exposed.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH0493950A |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS |
| title | EXPOSING METHOD FOR PRINTED WIRING BOARD |
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