EXPOSING METHOD FOR PRINTED WIRING BOARD

PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a...

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Bibliographische Detailangaben
1. Verfasser:	ASANO TOMOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent a decrease in resolution by arranging a scattering mirror between the printed wiring board where a photosensitive resist layer is formed and an exposure table and carrying out exposure. CONSTITUTION:The printed wiring board 3 which has the photosensitive resist layer 2 formed on a surface conductor layer 1 is prepared and the scattering mirror 7 is placed on the aligner table 4 while having its mirror surface opposite from the table 4; and the board 3 is placed thereupon and irradiated with ultraviolet rays while a photomask 5 is matched thereby photopolymerizing the resist layer 2 selectively. Light which passes through a through hole 6 at the time of the ultraviolet-ray irradiation is irregularly reflected by the scattering mirror and the internal wall of the hole 6 is exposed.