MACROMOLECULAR THERMISTOR MATERIAL

PURPOSE:To reduce hygroscopicity and to improve thermal resistance, electric characteristics and the like by using the specified weight parts of polyvinyl- chloride-based resin, trimellitic-acid-based plasticizer, epoxy-based plasticizer, dibasic lead sulfite and cation-based charge preventing agent. CONSTITUTION:As macromolecular thermistor materials, polyvinyl-chloride-based resin, trimellitic-acid-based plasticizer, epoxy-based plasticizer, dibasic lead sulfite, and cation-based charge preventing agent are used. The adding amount of the trimellitic-acid-based plasicizer is made to be 10-70 weight parts with respect to 100 weight parts of the polyvinyl-based resin, preferably 15-40 weight parts. The adding amount of the epoxy-based plasticizer is made to be 2-10 weight parts with respect to 100 weight parts of the polyvinyl-chloride-based resin, preferably 3-7 weight parts. The adding amount of dibasic lead sulfite, is made to be 3-15 weight parts with respect to 100 weight parts of the polyvinyl-chloride-based resin, preferably 5-10 weight parts. In this way, the electric characteristics (thermistor B constant) can be made large, and thermal resistance can be improved.