SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

PURPOSE:To improve the strength of a substrate against physical stress such as thermal deformation and distorsion, etc., by providing a lead terminal on one side of a film carrier, constructing a semiconductor device by folding the lead terminal at an arbitrary angle, and mounting the devices at arb...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KASAMATSU KAZUMI, AIKAWA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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