SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

PURPOSE:To improve the strength of a substrate against physical stress such as thermal deformation and distorsion, etc., by providing a lead terminal on one side of a film carrier, constructing a semiconductor device by folding the lead terminal at an arbitrary angle, and mounting the devices at arb...

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Bibliographische Detailangaben
Hauptverfasser:	KASAMATSU KAZUMI, AIKAWA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the strength of a substrate against physical stress such as thermal deformation and distorsion, etc., by providing a lead terminal on one side of a film carrier, constructing a semiconductor device by folding the lead terminal at an arbitrary angle, and mounting the devices at arbitrary angles with respect to the substrate arranging those devices parallel in succession. CONSTITUTION:A lead terminal 6 of a semiconductor device having a structure where a semiconductor chip 2 is held by an inner lead 3 in a device hole 1 of a film carrier 4 is taken out from the one side of the film carrier 4 in a single configuration. By mounting the devices successively parallel after folding the lead terminal 6 at an arbitrary angle, strength of a substrate 7 against physical stress such as thermal deformation and distorsion is increased and the lead terminal 6 is prevented from being broken.