SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To protect an interface between a chip surface and mold resin from slipping and enhance adhesion by installing uneven patterns to improve the adhesion between a semiconductor chip and mold resin on empty regions in the outer periphery of the semiconductor chip sealed in a resin-sealed type LSI package. CONSTITUTION:On a main side of a chip at the corner are installed uneven patterns 12 which comprise a plurality of projected sections laid out at a specified span and recessed sections 11 formed between the projected sections. The uneven patterns 12 are installed at each corner of the chip 3. More specifically, the main side of the chip 3 forms an integrated circuit formation region 13 in its central. Moreover, a number of bonding pads 7 are laid out at a specified span in the outer periphery section. However, since the four corners form empty regions, the uneven patterns 12 are installed at the four corners, using the empty regions.