JPH0458694B

PURPOSE:To prevent a bonded wire from bending in lateral direction, to make a movable part light in weight, and to enable to perform a high quality of bonding work at a high speed by a method wherein a capillary and the first clamper, which perform a vertical movement, and the second clamper which performs no vertical movement are provided and a closing timing is given to the second clamper when the capillary comes down. CONSTITUTION:A ball 3 is pressed to semiconductor 8 and connected by applying a supersonic vibration, load and heat under the state wherein a capillary 1 and the first clamper 5 are brought down in the direction as shown by the arrow B in the diagram and the ball 3 is tightly fixed to the tip of the capillary 1 by adding resistance to a wire 2 by the second clamper 6a. Then, the capillary 1 and the first clamper 5 are moved up in the direction of the arrow C as shown in the diagram, a substrate 10 is shifted in the direction shown by the arrow K by an X-Y table, and an external electrode 9 is positioned at the point located directly below the capillary 1. Then, the second clamper 6 is closed, and the capillary 1 and the first clamper 5 are brought down in the direction of the arrow B under the state wherein resistance is applied to the wire 2. At this time, as the wire 12 coming out from the tip of the capillary 1 enters from the tip of the capillary 1, the wire 12 is pressed to the external electrode 9 under the state wherein the wire of minimum length is brought out from the capillary.