METHOD FOR MEASURING PASSIVATION OF ELECTROLESS COPPER PLATING

PURPOSE:To accurately detect the passivation of electroless copper plating by impressing potential passivating copper to a copper electrode in a plating soln., stopping this impression, measuring the potential of the copper electrode and then measuring the time elapsed before the measured potential...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TOYOSHIMA TAKEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To accurately detect the passivation of electroless copper plating by impressing potential passivating copper to a copper electrode in a plating soln., stopping this impression, measuring the potential of the copper electrode and then measuring the time elapsed before the measured potential becomes the plating potential of electroless copper plating. CONSTITUTION:When electroless copper plating is carried out, a copper electrode, a measuring section consisting of a counter electrode and a reference electrode, a device for impressing potential on the copper electrode and a device for measuring the potential of the copper electrode are used. Potential passivating copper is impressed on the copper electrode in a plating soln., this impression is stopped, the potential of the copper electrode is measured and then the time elapsed before the measured potential becomes the plating potential of electroless copper plating is measured. The occurrence of defects such as a reduced thickness of plating due to passivation can be suppressed.