METHOD FOR PREVENTING WARPAGE OF THIN DISK

PURPOSE:To obtain the thin disk without warpage and deformation by making the thickness of the outer peripheral part of the disk larger than that of the central part thereof, when the thin disk of specified thickness is injection-molded. CONSTITUTION:When the thin disk with the thickness of at most...

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Bibliographische Detailangaben
1. Verfasser:	ISHIWATARI KIYOKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the thin disk without warpage and deformation by making the thickness of the outer peripheral part of the disk larger than that of the central part thereof, when the thin disk of specified thickness is injection-molded. CONSTITUTION:When the thin disk with the thickness of at most 1mm is injection-molded, the thickness of the outer peripheral part 3 of the disk is made larger than that of the central part 2 thereof. In order to increase the thickness of the outer peripheral part 3 of the thin disk 1, the outer peripheral part 3 of the thin disk 1 is thickened by masking a step or its thickness is gradually increased from the central part 2 to the outer peripheral part 3 similarly to a concave lens. Consequently, the product having no warpage and deformation and stable dimension is obtained, and its forming cycle is shortened due to no occurrence of warpage.