SEMICONDUCTOR PRESSURE SENSOR WAFER AND MANUFACTURE THEREOF

SEMICONDUCTOR PRESSURE SENSOR WAFER AND MANUFACTURE THEREOF

PURPOSE:To obtain a semiconductor pressure sensor wafer and a method for manufacturing the same, in which a semiconductor pressure sensor can be easily manufactured. CONSTITUTION:An alignment through hole 10 is provided at a semiconductor pressure sensor wafer 1 corresponding to an alignment through...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MIZUNO MICHIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:PURPOSE:To obtain a semiconductor pressure sensor wafer and a method for manufacturing the same, in which a semiconductor pressure sensor can be easily manufactured. CONSTITUTION:An alignment through hole 10 is provided at a semiconductor pressure sensor wafer 1 corresponding to an alignment through hole 6a formed in a glass base 5. Since cavities 3 and pressure introducing through holes 6 correspond to each other one-to-one merely by bringing the holes 10, 6a into coincidence, the wafer 1 can easily be aligned with the base 5 in a short time. As a result, a semiconductor pressure sensor can easily be manufactured.