SEMICONDUCTOR DEVICE AND CIRCUIT BOARD MOUNTED WITH SAID DEVICE

PURPOSE:To provide a semiconductor device of a structure in which an alignment is easy and a positional deviation does not occur when the device is mounted directly on a circuit board and the circuit board. CONSTITUTION:A semiconductor device in which a semiconductor chip 2 is mounted directly on a...

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Bibliographische Detailangaben
1. Verfasser:	KOYAMA SHIGEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a semiconductor device of a structure in which an alignment is easy and a positional deviation does not occur when the device is mounted directly on a circuit board and the circuit board. CONSTITUTION:A semiconductor device in which a semiconductor chip 2 is mounted directly on a circuit board, has a member 1 having a heat sink integral with a cap, a chip 2 connected to the member 1, and a guide pin 3 secured to the member 1, wherein in the pin 3 protrudes from a flat surface including a mounting surface of the chip 2 on the board.