METHOD OF DESIGN SUPPORT FOR SEMICONDUCTOR DEVICE STRUCTURE

PURPOSE:To reduce time and energy in designing a semiconductor structure. CONSTITUTION:A design support method includes a step 110 of determine necessary levels and sufficient levels for a plurality of characteristics including the maximum chip temperature and the life of solder; a step 120 of calcu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OSHIMA TAKEHIKO, YASUKAWA AKIO, KANAI KIYOSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To reduce time and energy in designing a semiconductor structure. CONSTITUTION:A design support method includes a step 110 of determine necessary levels and sufficient levels for a plurality of characteristics including the maximum chip temperature and the life of solder; a step 120 of calculating the individual characteristic values under given design variables; a step 130 of evaluating the degree of satisfaction about the individual characteristic values based on the necessary and sufficient levels; and a step 140 of giving a graphic presentation that integrally shows the resulting characteristics of the relation between the degree of satisfaction and the design variables. The graphic presentation makes it easy to grasp the design scope and thus reduces time and energy.