SEMICONDUCTOR DEVICE

PURPOSE:To obtain a semiconductor device wherein reliability of contact in a contact hole part and reliability of bonding are high, regarding a semiconductor device having a multilayered wiring structure. CONSTITUTION:Barrier metal 3 is laminated on the whole surface of the lower side of first layer...

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Bibliographische Detailangaben
1. Verfasser:	ABE YASUNARI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a semiconductor device wherein reliability of contact in a contact hole part and reliability of bonding are high, regarding a semiconductor device having a multilayered wiring structure. CONSTITUTION:Barrier metal 3 is laminated on the whole surface of the lower side of first layer aluminum wiring 4. A bonding pad 11 is led out from second layer aluminum wiring 6 or wiring in the upper layers than the wiring 6.