HEAT DISSIPATOR OF SEMICONDUCTOR INTEGRATED CIRCUIT

HEAT DISSIPATOR OF SEMICONDUCTOR INTEGRATED CIRCUIT

PURPOSE:To conduct excellent heat dissipation by facilitating assembly and exchange with the heat dissipation of a bare chip semiconductor integrated circuit such as TAB and by making sure contacts even with a poor precision in level dimension but without giving stress to the TAB and the like. CONST...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKAMURA YUKIO, UMIBE SUSUMU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To conduct excellent heat dissipation by facilitating assembly and exchange with the heat dissipation of a bare chip semiconductor integrated circuit such as TAB and by making sure contacts even with a poor precision in level dimension but without giving stress to the TAB and the like. CONSTITUTION:Metal plates 17 coated with a heat dissipating silicon resin 18 in one side are assembled in a matrix form over the top face which is the rear of a TAB semiconductor integrated circuit 14 and held down with a metal case 19 from above, thereby being deformed to make contacts with them.