PRINTED WIRING BOARD AND ITS MANUFACTURE

PURPOSE:To provide a low-cost printed board whereby low-impedance patterns of desired characteristics impedance can easily be obtained which design-changes general-purposed patterns into low-impedance patterns, and low-impedance patterns into general-purposed patterns in regard with a printed wiring...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TOMINAGA JUNJI, SAKAI MIYOSHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To provide a low-cost printed board whereby low-impedance patterns of desired characteristics impedance can easily be obtained which design-changes general-purposed patterns into low-impedance patterns, and low-impedance patterns into general-purposed patterns in regard with a printed wiring board having patterns different in characteristics impedance in the same layer and its manufacture. CONSTITUTION:This printed wiring board has in the same layer an impedance- controlled low-impedance pattern 5 as wide as a general-purposed pattern 2 and thicker as predetermined than the general-purposed pattern 2.