SEPARATING METHOD OF CHIP RESISTOR

PURPOSE:To provide the title separating method of chip resistor at the higher separation rate hardly producing a defective product. CONSTITUTION:Two rollers 1, 2 are oppositely arranged at a regular interval to be turned at mutually different R.P.M. so that mutually bonded chip resistors 5 may be fe...

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Bibliographische Detailangaben
Hauptverfasser: HAKUKAWA FUJIO, INOUE SHINJI, INOUE HIROTOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide the title separating method of chip resistor at the higher separation rate hardly producing a defective product. CONSTITUTION:Two rollers 1, 2 are oppositely arranged at a regular interval to be turned at mutually different R.P.M. so that mutually bonded chip resistors 5 may be fed to the space between both rollers 1, 2 by a carrier means 3 to separate the chip resistors 5 into individual resistors 5a, 5b. Through these procedures, the separating force can be given to the chip resistors 5 when they are held by both rollers 1, 2.