SEMICONDUCTOR DEVICE RECEIVING MAGAZINE

PURPOSE:To remove necessity of taking out more semiconductor devices than desired, take out only the desired semiconductor device, and enhance operating efficiency of taking it out. CONSTITUTION:A pair of IC tubes 2a, 2b is inserted into both ends of a connector 4 to be coupled to each other. A devi...

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Bibliographische Detailangaben
1. Verfasser:	NAKAZATO TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To remove necessity of taking out more semiconductor devices than desired, take out only the desired semiconductor device, and enhance operating efficiency of taking it out. CONSTITUTION:A pair of IC tubes 2a, 2b is inserted into both ends of a connector 4 to be coupled to each other. A device taking-out outlet 6g is formed in the central part of the connector 4. Until a semiconductor device D which is located within the one IC tube 2a and which is desired to be taken out comes to the device taking-out outlet 6g, the other semiconductor devices D slidably move within the connector 4 and the other IC tube 2b.