COPPER ALLOY PLATE FOR ELECTRONIC COMPONENT AND MANUFACTURE THEREOF

PURPOSE:To realize strong adhesion even if a different material is joined and attached to a surface of a copper alloy raw material, to prevent generation of smuts even if a copper alloy plate is acid-cleaned, and to improve attaching strength of plating and resin bonding. CONSTITUTION:A surface of a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MANOME MINORU, OZAKI TOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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