COPPER ALLOY PLATE FOR ELECTRONIC COMPONENT AND MANUFACTURE THEREOF

PURPOSE:To realize strong adhesion even if a different material is joined and attached to a surface of a copper alloy raw material, to prevent generation of smuts even if a copper alloy plate is acid-cleaned, and to improve attaching strength of plating and resin bonding. CONSTITUTION:A surface of a...

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Bibliographische Detailangaben
Hauptverfasser:	MANOME MINORU, OZAKI TOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PURPOSE:To realize strong adhesion even if a different material is joined and attached to a surface of a copper alloy raw material, to prevent generation of smuts even if a copper alloy plate is acid-cleaned, and to improve attaching strength of plating and resin bonding. CONSTITUTION:A surface of a copper alloy substrate 11 having 1 to 10 atomic % of Sn, Zr, C, Ti and Ag in total is cleaned by acid. Thereafter, a first copper plating layer 13 whose total of Sn, Zr, C, Ti and Ag is at most 1 atomic % is formed on at least one side surface layer part of the copper alloy substrate 11. The copper alloy substrate 11 whereon the copper plating layer 13 is formed is rolled to disperse a smut layer 12 which attaches to an interface between a surface and a plating layer. After a second copper plating layer 14 is formed, formation of a plating layer and rolling process are repeated several times such as another rolling processing, and a copper plating layer is formed to a final thickness of 0.3 to 3mum.