FORMATION OF TAB BUMP CONTACT
PURPOSE:To form a TAB bump contact with good productivity and at a low cost. CONSTITUTION:The tip of the lead part 4 of a film carrier 3 made by the lamination of metallic fall 2 on insulating film 1 is subjected to bending so that a part of the lead part 4 is formed by projecting as a bump contact...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PURPOSE:To form a TAB bump contact with good productivity and at a low cost. CONSTITUTION:The tip of the lead part 4 of a film carrier 3 made by the lamination of metallic fall 2 on insulating film 1 is subjected to bending so that a part of the lead part 4 is formed by projecting as a bump contact 5. This bending enables conducting a bump formation without requiring a process such as etching and many other processes. |
|---|