SURFACE ACOUSTIC WAVE CONVOLVER DEVICE

PURPOSE:To save the wire bonding process through the use of the face bonding method, to improve the mechanical strength and to eliminate the effect on its characteristic due to a rough surface adopted for the rear side of an element. CONSTITUTION:An epitaxial Si layer 26, an insulation film 27 and a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NIITSUMA TERUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
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