BOND APPLICATION DEVICE

PURPOSE:To apply an appropriate amount of bonding agent to a substrate. CONSTITUTION:This bond application device consists of a substrate positioning part, a dispenser driven by a mobile table to apply a bonding agent to the substrate, a test application table on which test point bonds are test-appl...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IMAMURA TOSHIBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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