BOND APPLICATION DEVICE

PURPOSE:To apply an appropriate amount of bonding agent to a substrate. CONSTITUTION:This bond application device consists of a substrate positioning part, a dispenser driven by a mobile table to apply a bonding agent to the substrate, a test application table on which test point bonds are test-appl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	IMAMURA TOSHIBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To apply an appropriate amount of bonding agent to a substrate. CONSTITUTION:This bond application device consists of a substrate positioning part, a dispenser driven by a mobile table to apply a bonding agent to the substrate, a test application table on which test point bonds are test-applied using the dispenser, arranged near the substrate positioned using the positioning part and a camera for viewing test-applied bonds on the test application table, driven by the mobile table. Thus it is possible to apply the bonding agent to the substrate with the concurrent monitoring of a properly applicable dosage.